Sputtering system

Details Sputtering system Sputtering system

1984-03-29

1984-10-23

Demers, Arthur P.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192R, C23C 1500

Patent

active

044787030

ABSTRACT:
A sputtering system including a workpiece and at least one target located in a vacuum reaction furnace, wherein a magnetic field is generated between the workpiece and the target and a electric field perpendicular to the magnetic field generated between the workpiece and the target is additionally generated. A plurality of targets may be located around the workpiece and either the workpiece or the targets may be rotated when the magnetron discharge is generated.

REFERENCES:
patent: 4022939 (1977-05-01), Roth et al.
patent: 4113082 (1978-09-01), Timin
patent: 4147573 (1979-04-01), Morimoto
patent: 4170541 (1979-10-01), Lamont
patent: 4230515 (1980-10-01), Zajac

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