Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1987-12-24
1989-08-01
Niebling, John F.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
204298, C23C 1400
Patent
active
048531022
ABSTRACT:
A sputtering process and an apparatus for carrying out the same for forming a film of a film forming material over the surface of a substrate. A target formed of the film forming material is held on a sputtering electrode receiving a voltage, and the substrate is disposed at a predetermined distance and opposite to the target. A high-density plasma is produced by producing a cusp field between the target and the substrate and a bias voltage is applied to the surface of the substrate to make ions of the high-density plasma fall on the surface of the substrate in order to make the particles of the film forming material sputtered from the target deposit in a thin film over the surface of the substrate.
REFERENCES:
patent: 3325394 (1967-06-01), Kay et al.
patent: 4025410 (1977-05-01), Stewart
patent: 4588343 (1986-05-01), Garrett
patent: 4605469 (1986-08-01), Shih et al.
patent: 4670126 (1987-06-01), Messer et al.
patent: 4721553 (1988-01-01), Saito et al.
Horiuchi Mitsuaki
Saito Hiroshi
Sasaki Shinji
Tateishi Hideki
Hitachi , Ltd.
Marquis Steven P.
Niebling John F.
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