Sputtering method for reducing hillocking in aluminum layers for

Details Sputtering method for reducing hillocking in aluminum layers for Sputtering method for reducing hillocking in aluminum layers for

1985-11-12

1990-01-02

Nguyen, Nam X.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

20419215, 20419235, C23C 1434

Patent

active

048911127

ABSTRACT:
Hillock formation in a layer of aluminum sputtered from a target onto a substrate is reduced by applying a potential to the substrate sufficient to cause some resputtering of some aluminum from the deposited layer while at the same time sputtered aluminum from a target is being deposited onto the surface of the substrate. Aluminum grain size in the deposited layer is reduced to the extent that stress is relieved.

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