Sputtering method and apparatus with optical monitoring

Details Sputtering method and apparatus with optical monitoring Sputtering method and apparatus with optical monitoring

1998-11-30

2000-08-29

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429803, C23C 1434

Patent

active

061103373

ABSTRACT:
In a method of sputtering thin films onto a substrate, the substrate is placed below a sputtering source assembly in a vacuum chamber. A light beam is projected onto the substrate and passes through an optical passage in the sputtering source assembly. In this way, the growth of the sputtered film can be accurately monitored at near normal angles of incidence.

REFERENCES:
patent: 4288307 (1981-09-01), Kiyotaka Wasa
patent: 4336119 (1982-06-01), Gillery
patent: 4676883 (1987-06-01), Nelson et al.
patent: 4951663 (1990-08-01), L'Esperance, Jr.
patent: 4975168 (1990-12-01), Ichiro Ohno et al.
patent: 5002631 (1991-03-01), Giapis et al.
patent: 5154810 (1992-10-01), Kamerling et al.
patent: 5403433 (1995-04-01), Morrison et al.
patent: 5490912 (1996-02-01), Warner et al.
patent: 5766426 (1998-06-01), Clarke
patent: 5822211 (1998-10-01), Barenboim et al.
D.A. Walsh, et al.; "Optical thickness monitor for sputtered films"; Rev. Sci. Instrum., vol. 47, No. 8; pp. 932-934, Aug. 1976.

Affiliated with

Also associated with

Rating

Sputtering method and apparatus with optical monitoring does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sputtering method and apparatus with optical monitoring, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sputtering method and apparatus with optical monitoring will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1245904