Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1996-04-08
1997-09-30
Breneman, R. Bruce
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20429811, 20429815, 20429823, 20429825, C23C 1434, C23C 1456
Patent
active
056722559
ABSTRACT:
A sputtering device for coating a substrate which enters the device downstream and exits the device upstream. The device includes a vacuum container having a gas exhausting portion; a gas providing portion for providing inactive gas and reactive gas into the vacuum container upstream of the gas exhausting portion; a target provided in the vacuum container between a gas inlet and the gas exhausting portion; a diffusion interval from the target to the gas inlet, the diffusion interval having a length at least as great as the shortest distance between the target and the substrate to be coated; substrate supporting structure for supporting the substrate so that the substrate faces the target; and a plasma producing portion to produce gas plasma near the substrate. The reactive gas uniformly diffuses with the inactive gas within the diffusion interval, is made to be a plasma state, and reacts with sputtering particles scattered from the target to form a uniform film on a surface of the substrate.
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ULVAC Technical Journal, Mar./1989, No. 31, pp. 9-13.
Hamada Tsutomu
Hikichi Takehito
Breneman R. Bruce
Fuji 'Xerox Co., Ltd.
McDonald Rodney G.
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