Sputtering device

Details Sputtering device Sputtering device

2006-08-15

2006-08-15

McDonald, Rodney G. (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S298230, C204S298260, C204S298120, C204S192120

Reexamination Certificate

active

07090754

ABSTRACT:
An object of the invention is to provide a method of sputtering and a device for sputtering which can improve distribution of a film's thickness and coverage distribution improve. The device for sputtering includes at least a substrate, a substrate holder which holds the substrate, a target for forming a thin film on the substrate, a sputtering cathode in which the target is installed, a means for sputtering which makes materials of the target sputter to the substrate. Sputtering is carried out by making the substrate holder rotate and making a sputter cathode unit comprising at least one sputtering cathode move along an arc over the rotating substrate held on the substrate holder.

REFERENCES:
patent: 3502562 (1970-03-01), Humphries
patent: 3616451 (1971-10-01), Gallez
patent: 4094764 (1978-06-01), Boucher et al.
patent: 4407894 (1983-10-01), Kadokura et al.
patent: 6143149 (2000-11-01), Abe
patent: 6641702 (2003-11-01), Shi et al.

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