Sputtering deposition apparatus and method utilizing charged par

Details Sputtering deposition apparatus and method utilizing charged par Sputtering deposition apparatus and method utilizing charged par

1995-08-14

1998-11-24

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429806, 20429819, C23C 1434

Patent

active

058401679

ABSTRACT:
A sputtering deposition apparatus and method wherein a deposition material is sputtered from a target, the sputtered deposition material is ionized, and a thin film of the ionized deposition material is deposited onto a wafer.

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