Sputtering cathode adapter assembly and method

Details Sputtering cathode adapter assembly and method Sputtering cathode adapter assembly and method

2006-02-14

2006-02-14

Versteeg, Steven (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S192100, C204S192120

Reexamination Certificate

active

06998033

ABSTRACT:
An adapter assembly is provided for supporting a sputtering cathode in a fixed opening in the chamber of a sputter coating machine. The assembly includes: one of several adapter bodies, each configured to support, in the fixed opening, a target of one of a plurality of sizes and types, and at one of several target-to-substrate spacings; one of several insulator rings, each for a target of a different size or type; one of several dark-space shields, each for a target of a different size, type, material, or processing pressure; and one of several adapter shields, each for a different adapter body and target material. Only the shields accumulate deposits and require cleaning or replacement. The dark-space shield is spaced from the target rim by a gap of at 0.045 to 0.067 inches to form a deep narrow space that prevents deposits onto the insulator ring while avoiding arcing and plasma formation in the gap. A method is provided for existing sputtering machines with the assembly, which accommodates different targets and processes.

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patent: WO 96/36065 (1996-11-01), None
patent: WO 00/77273 (2000-12-01), None

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