Sputtering cathode

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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Details

20419212, C23C 1434

Patent

active

047801905

ABSTRACT:
The invention relates to a cathode (1) intended for spraying thin layers of materials onto one or more substrates using the cathodic sputtering method.
It consists of a structure (V-shaped) comprising an electrical supply, cooling members and two sputtering planes (6, 7) in which there are arranged side by side at least two strips of target material joined at their ends forming a single continuous target material track extending between and positioned in at least two separate planes, the track being confined within a single magnetic circuit, which also extends between and is positioned in the at least two separate planes, with the result that it is possible to treat simultaneously two substrates (44) arranged on their supports (43) on each side of the cathode (1).
The cathode (1) according to the invention is particularly recommended for sputtering substrates of large size, such as glass.

REFERENCES:
patent: 3956093 (1976-05-01), McLeod
patent: 4175030 (1979-11-01), Love
patent: 4179351 (1979-12-01), Hawton, Jr. et al.
patent: 4194962 (1980-03-01), Chambers et al.
patent: 4200510 (1980-04-01), O'Connell et al.
patent: 4221652 (1980-09-01), Kuriyama
patent: 4356073 (1982-10-01), McKelvey
patent: 4415427 (1983-11-01), Hidler et al.
patent: 4443318 (1984-04-01), McKelvey
patent: 4468313 (1984-08-01), Okumura et al.
patent: 4517070 (1985-05-01), Kisner
patent: 4564435 (1986-01-01), Wickersham

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