Sputtering cathode

Details Sputtering cathode Sputtering cathode

1992-01-28

1993-11-30

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429808, 20429816, 20419212, C23C 1434

Patent

active

052661784

ABSTRACT:
The invention relates to a sputtering cathode for coating substrates in cathode sputtering apparatus, with a cathode base body 5, a target of nonmagnetic material disposed thereon and having at least one flat sputtering surface 9a, a magnet system 7 with pole faces 7c, 7d, of opposite polarity lying on both sides of the target margins for the production of a closed tunnel of magnetic lines of force overarching the sputtering surface 9a, while the pole shoes 23, 24, surrounding the target reach at least to the outer boundary of the target 9 or partially overlap the latter.

REFERENCES:
patent: 4370217 (1983-01-01), Funaki
patent: 4391697 (1983-07-01), Morrison, Jr.
patent: 4405436 (1983-09-01), Kobayashi et al.
patent: 4515675 (1985-05-01), Kieser et al.
patent: 4572776 (1986-02-01), Aichert et al.
patent: 4933064 (1990-06-01), Geisler et al.

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