Sputtering cathode

Details Sputtering cathode Sputtering cathode

1984-08-24

1987-03-24

Niebling, John F.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

2041922, 219121ED, C23C 1436

Patent

active

046523588

ABSTRACT:
The invention relates to a cathode system for sputtering apparatus which includes a target plate of ferromagnetic material. A magnet system is situated behind the target plate and has opposed poles positioned so that at least a portion of the lines of force emerging from the poles passes out through the target and returns thereto. The target is placed on a floor which includes strips of ferromagnetic material in the area of the poles of the magnet system. These strips close the magnetic circuit between the magnet system and the target plate. The remainder of the floor is made of nonmagnetic material.

REFERENCES:
patent: 4169031 (1979-09-01), Brors
patent: 4324631 (1982-04-01), Meckel et al.
patent: 4405436 (1983-09-01), Kobayashi et al.
patent: 4425218 (1984-01-01), Robinson
patent: 4448653 (1984-05-01), Wegmann
patent: 4500409 (1985-02-01), Boys et al.

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