Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1996-03-07
1998-04-07
Breneman, R. Bruce
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20429809, 20429811, 20429814, 20429816, 20429819, 20419212, 20429808, 20429812, C23C 1434
Patent
active
057360197
ABSTRACT:
A magnetron sputtering electrode for use within a magnetron sputtering device having more uniform cooling of the target with the use of a water chamber including water diverters to establish a turbulent water flow within the water chamber. The electrode also includes a direct power coupling to the cathode body to avoid degradation of the power supplied to the electrode. The electrode further includes introduction of process gas in an interstitial space between the anode shield and the cathode shield. The electrode also includes the use of removable shaped magnets providing improved target utilization and run times and a choice of erosion pattern and balanced or unbalanced sputtering by simple magnet substitution. In one embodiment, the invention includes the use of a threaded anode shield and a threaded cathode shield which significantly reduces the overall electrode size for a given target diameter.
REFERENCES:
patent: 3945911 (1976-03-01), McKelvey
patent: 4094764 (1978-06-01), Boucher et al.
patent: 4100055 (1978-07-01), Rainey
patent: 4169031 (1979-09-01), Brors
patent: 4312731 (1982-01-01), Morrison, Jr.
patent: 4361749 (1982-11-01), Lord
patent: 4434042 (1984-02-01), Keith
patent: 4461688 (1984-07-01), Morrison, Jr.
patent: 4818358 (1989-04-01), Hubert et al.
patent: 4826584 (1989-05-01), dos Santos Pereiro Ribeiro
patent: 4865708 (1989-09-01), Welty
patent: 5174880 (1992-12-01), Bourez et al.
patent: 5180478 (1993-01-01), Hughes
patent: 5259941 (1993-11-01), Munz
patent: 5262030 (1993-11-01), Potter
patent: 5322605 (1994-06-01), Yamanishi
patent: 5399252 (1995-03-01), Scherer et al.
patent: 5407551 (1995-04-01), Sieck et al.
patent: 5415754 (1995-05-01), Manley
patent: 5421978 (1995-06-01), Schuhmacher et al.
patent: 5433835 (1995-07-01), Demaray et al.
Breneman R. Bruce
McDonald Rodney G.
LandOfFree
Sputtering cathode does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Sputtering cathode, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sputtering cathode will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-9546