Sputtering apparatus with rotating target and target cooling

Details Sputtering apparatus with rotating target and target cooling Sputtering apparatus with rotating target and target cooling

1992-07-23

1993-11-16

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429809, 20429822, 20419212, C23C 1434

Patent

active

052620328

ABSTRACT:
A sputtering apparatus is presented, especially one with a magnetron cathode and rotating target (1), and target cooling performed by a liquid coolant, preferably water, in which provision is made for the cooling to be concentrated on the area or areas of the rotating target (1) which are exposed to the heat produced by the plasma (12), and the magnets (28, 29, 30, 31) of the magnet assembly (23) form at least one cooling passage (34, 35).

REFERENCES:
patent: 3829373 (1974-08-01), Kuehnle
patent: 3878085 (1975-04-01), Corbani
patent: 4116806 (1978-09-01), Love et al.
patent: 4275289 (1981-06-01), Lord
patent: 4443318 (1989-04-01), McKelvey
patent: 4445997 (1984-05-01), McKelvey
patent: 4466877 (1984-08-01), McKelvey
Wright & Beardow "Design Advances and Applications of the Rotatable Cylindrical Magnetron" J. Vac. Sci. Techn. A4(3) Jun. 1988 pp. 388-392.

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