Sputtering apparatus with magnetic orienting device for thin fil

Details Sputtering apparatus with magnetic orienting device for thin fil Sputtering apparatus with magnetic orienting device for thin fil

1997-04-25

1999-05-11

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

2041922, 20429809, C23C14/34

Patent

active

059024666

ABSTRACT:
A sputtering apparatus for depositing a thin film (66) of magnetic material on a substrate (26) is modified to include a plate-shaped electromagnet (34, 44, or 70) for orienting magnetic domains within the film (66). The electromagnet (34, 44, or 70) has conductive windings (38; 46, 48, and 50; or 72) that are arranged for producing a magnetic field (42 or 52) within a plane (60) corresponding to a surface of the substrate (26). Field strength vectors (68) vary in absolute magnitude between points located along a first axis (62), but have substantially uniform components of magnitude at the same points measured in a common direction along the first axis (62).

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Paper entitled "Manufacturing Techniques", pp. 1-28.
"Ferromagnetic Properties of Films" by Mitchell S. Cohen, M.I.T. Lincoln Laboratory, Lexington, Mass., Ch. 17, pp. 17-1 thru 17-43.
"Relation of Thickness and Some Physical Properties of NiFe Thin Films" by R.M. Valletta, G. Guthmiller, and G. Gorman, J. Vac. Sci. Technol. A9 (4) Jul./Aug. 1991, American Vacuum Society, pp. 2093-2098.

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