Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1985-11-14
1988-02-09
Niebling, John F.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20419212, C23C 1434
Patent
active
047240601
ABSTRACT:
A target for use in a sputtering technique usually has a flat structure. The present invention has succeeded in endowing sputtering film formation with a directivity in such a way that the surface of the target is provided with recesses thereby to limit the flight directions of sputtering particles.
Alternatively, the directivity can be bestowed by disposing a frame between a substrate to be formed with a film and the flat sputtering target. This measure requires auxiliary means in which a wall is provided at the outer periphery of the sputtering target so as to effectively utilize a plasma.
The present invention actually formed films by the use of the above technique, and has verified the effect thereof. Wide applications are expected in technical fields wherein after forming a microscopic pattern, one or more films need to be further formed.
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Abe Katsuo
Kamei Tsuneaki
Kawahito Tsuneyoshi
Kobayashi Shigeru
Sakata Masao
Hitachi , Ltd.
Nguyen Nam X.
Niebling John F.
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