Sputtering apparatus and methods using a magnetic field

Details Sputtering apparatus and methods using a magnetic field Sputtering apparatus and methods using a magnetic field

1975-08-25

1977-05-24

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204298, C23C 1500

Patent

active

040254100

ABSTRACT:
The operation of a sputtering apparatus is improved by selectively enhancing the sputtering on portions of a cathodic target located across from a peripheral area of a workholder. Such enhancement is produced by a magnetic field having flux lines extending substantially parallel to the target into a peripheral segment of a space between the target and the workholder. Relative motion between the magnetic field and the workholder uniformly distributes the effect of the increase in sputtering over the entire periphery of the workholder.

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E. Kay "Magnetic Field Effects on an Abnormal Truncated Glow Discharge and Their Relation to Sputtered Thin-Film Growth," J. Appl. Phys, vol. 34, pp. 760-768 (1963).

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