Sputtering apparatus and methods

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204192R, 204192EC, C23C 1500

Patent

active

044500629

ABSTRACT:
A method of depositing material onto an object in an ionization chamber having a shutter therein which has an object-obscuring portion comprising the step of confining particles of matter deposited on the object-obscuring portion of the shutter to such object-obscuring portion while the object is being deposited with material. The object-obscuring portion of the shutter includes an open ended container, the open end thereof being formed in an upper portion of the shutter. During ionization a glow region is formed in the chamber separated from a source of the material by a dark space region. The upper surface of the shutter is disposed in the dark space region and the bottom of the container is separated from the source sufficiently to enable ionization. Prior to deposition of the material onto the object, the object-obscuring portion of the shutter is positioned between a source of the material and the object and contaminents on the surface of such source are removed therefrom and are collected within the container. After this cleaning process, the object-obscuring portion of the shutter is removed from between the source and the object to allow deposition of the material onto the object. The container confines particles of the matter collected therein during the cleaning process and prevents such particles from falling onto the object during the object deposition process.

REFERENCES:
patent: 3652444 (1972-02-01), Lester et al.
patent: 3933644 (1976-01-01), Skinner et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Sputtering apparatus and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sputtering apparatus and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sputtering apparatus and methods will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1477437

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.