Sputtering apparatus and method

Details Sputtering apparatus and method Sputtering apparatus and method

1983-11-17

1985-02-12

Demers, Arthur P.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192R, C23C 1500

Patent

active

044989695

ABSTRACT:
A apparatus and method is described for the magnetron sputtering of a workpiece to deposit a thin metallic film. A rotating magnetic field is provided in the vicinity of the workpiece to produce higher yield from a given cathode target.

REFERENCES:
patent: 4221652 (1980-09-01), Kuriyama
patent: 4309266 (1982-01-01), Nakamura et al.

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