Sputtering apparatus

Details Sputtering apparatus Sputtering apparatus

1986-09-25

1987-06-16

Demers, Arthur P.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

2041922, C23C 1400

Patent

active

046734821

ABSTRACT:
A sputtering apparatus for sputtering magnetic materials. The apparatus comprises at least one pair of magnetic field-generating sources, a substrate disposed within the magnetic field-generating sources, a target disposed opposite to the substrate, and a magnetic thin plate disposed at a side of the substrate which is remote from the target. The magnetic thin plate is disposed at a position in close contact with the substrate or a position slightly away from the substrate, or is disposed movably between such positions. When sputtering a magnetic material onto the substrate, a uniform magnetic field can be generated on the substrate surface by virtue of the provision of the thin magnetic plate.

REFERENCES:
patent: 4361472 (1982-11-01), Morrison
patent: 4401546 (1983-08-01), Nakamura et al.
patent: 4422896 (1983-12-01), Class et al.
patent: 4434038 (1984-02-01), Morrison
patent: 4448653 (1984-05-01), Wegmann
patent: 4461688 (1984-07-01), Morrison
patent: 4601806 (1986-03-01), Wirz
patent: 4606802 (1986-08-01), Kobayashi
Meckel et al, Research Disclosure, Oct. 1979, pp. 537-540.
Kirov et al, Vacuum, 28 (1978) pp. 183-186.

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