Sputtering apparatus

Details Sputtering apparatus Sputtering apparatus

1994-12-23

1997-03-11

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, 2041922, 20429816, 20429811, C23C 1434

Patent

active

056097395

ABSTRACT:
A sputtering apparatus for performing sputtering operation by using a rectangular target made of ferromagnetic material, the apparatus includes an electrode in which one first permanent magnet is disposed on each side edge of a front surface of the target, polarities of the first magnets confronting each other with the target interposed between the first magnets are opposite to each other, one second permanent magnet is disposed on each side edge of a rear surface of the target, polarities of the second magnets confronting each other with the target interposed between the second magnets are opposite to each other, and the polarity of each second magnet disposed on the rear surface of the target is the same as that of the first magnet disposed on the front surface of the target.

REFERENCES:
patent: 4880515 (1989-11-01), Yoshikawa et al.
patent: 4891560 (1990-01-01), Okumura et al.
patent: 5227778 (1994-01-01), Daube et al.
patent: 5397448 (1995-03-01), Gesche et al.
patent: 5403457 (1995-04-01), Nago et al.

Affiliated with

Also associated with

Rating

Sputtering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sputtering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sputtering apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-440401