Sputtering apparatus

Details Sputtering apparatus Sputtering apparatus

1980-06-05

1981-09-22

Gantz, Delbert E.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192SP, C23C 1500

Patent

active

042908760

ABSTRACT:
There is disclosed a combination of a target of a material other than metals and one of opposed electrodes of a sputtering apparatus for the deposition of thin films on substrates wherein the target is soldered on the electrodes by a low-melting alloy consisting essentially of a Pb-Sn-Zn alloy and at least one additive selected from the group consisting of Sb, Al, Ti, Si, Cd and Cu.
This target installation enables to prevent porous or poor heat-conducting targets from the breakage resulting from the increase of the film-forming rate or physical properties of the target material such as ceramics, glasses, resins and the like.

REFERENCES:
patent: 4209375 (1980-06-01), Gates
J. van Esdonk et al., "Joining a Sputter Target and a Backing Plate", Research/Development, Jan. 1975, pp. 41, 43-44.

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