Sputtering apparatus

Details Sputtering apparatus Sputtering apparatus

1999-11-29

2001-09-11

Mills, Gregory (Department: 1763)

Coating apparatus

Gas or vapor deposition

With treating means

C204S298010, C204S192120, C118S7230AN, C118S719000

Reexamination Certificate

active

06286452

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Technical Field of the Invention
The present invention relates to a sputtering apparatus whereby film deposition is performed in vacuum on to a semiconductor wafer or disk such as a CD or DVD.
2. Description of Prior Art
An example of a prior art sputtering apparatus disclosed in Japanese Laid-Open Patent Application No. 7-102366 will be described with reference to FIG.
7
. In
FIG. 7
, a substrate
60
is mounted on a substrate holder
63
which is arranged fixed to a door
62
of chamber
61
, and a cathode
64
is arranged so as to face substrate holder
63
. A shutter plate
65
is arranged in a retractable manner between substrate holder
63
and cathode
64
. A sputtering power source
66
applies voltage to cathode
64
. A vacuum evacuation port
67
is provided on one side of chamber
61
and a gas introduction port
68
is provided on the other side for introducing sputtering gas. An earth shield
69
is arranged around cathode
64
, and a shield
70
is provided such as to surround the peripheral part of substrate holder
63
.
For film deposition, door
62
is opened and a substrate
60
is held on substrate holder
63
; door
62
is then closed and vacuum evacuation is performed from vacuum evacuation port
67
and sputtering gas is introduced from gas introduction port
68
whilst maintaining the interior of chamber
61
at a predetermined vacuum pressure; a sputtered film is formed on substrate
60
by applying negative charge to cathode
64
by means of sputtering power source
66
. After this, the interior of chamber
61
is returned to atmospheric pressure, door
62
is opened, substrate
60
on which the film has been formed is removed, and a substrate on to which film is to be deposited is supplied to substrate holder
63
.
Such sputtering apparatuses are used on account of their low equipment cost, simplicity and suitability for batch production.
However, in such sputtering apparatuses, since vacuum evacuation and opening to the atmosphere are repeated every time film deposition is performed, the processing efficiency shows considerable dependence on the time required for vacuum evacuation to the background vacuum pressure for sputtering. However, with the sputtering apparatus of conventional construction, time is required for the vacuum evacuation since, in particular, vacuum evacuation of the interior space is obstructed by shield
70
which is arranged surrounding the peripheral part of substrate holder
63
in what is close to a sealed condition; there was therefore the problem that processing efficiency was adversely affected.
A further problem was that in the conventional sputtering apparatus consideration was not given to the automation of mounting and removal of the substrate and it was not possible to improve production efficiency.
SUMMARY OF THE INVENTION
In view of the above problems of the prior art, an object of the present invention is to provide a sputtering apparatus wherein the time required for vacuum evacuation can be reduced and wherein the efficiency of the film formation process can be raised by automating the mounting and removal of the substrate.
In a sputtering apparatus according to the present invention, a gas introduction port for introducing a sputtering gas into the chamber is provided on one side in a direction orthogonal to the direction of opening and closing of the door of the chamber, while a vacuum evacuation port is provided on the other side of the chamber. A substrate holder is provided on the door of the chamber, and a cathode is provided on a wall face of the chamber facing the door of the chamber. A shield is arranged in close proximity to and so as to cover the peripheral part of the substrate holder, and this shield has a hole formed in a location facing the vacuum evacuation port.
Thereby, the shield in a condition close to sealing the peripheral part of the substrate holder performs its function satisfactorily, and yet, even though the volume of the interior space is large, rapid vacuum evacuation can be effected due to the formation of the hole in a location of the shield facing the vacuum evacuation port. Consequently, even though the capacity of the vacuum pump is the same, the time required for the vacuum evacuation can be shortened, thereby improving processing efficiency. Also, since the hole of the shield is formed on the opposite side to the gas introduction port i.e. on the side facing the vacuum evacuation port, the formation of the hole involves little risk of film deposition on the substrate holder, so there is no possibility of the function of the shield being impaired.
If the cathode is arranged offset to the gas introduction port side with respect to the substrate holder, and a rotary mechanism is provided on the substrate holder, film deposition of uniform thickness on to the substrate can be achieved by introducing gas from one side of the chamber and performing vacuum evacuation from the other side, and the risk of film deposition on the substrate holder through the hole can be reduced even further.
In a sputtering apparatus according to another aspect of the present invention, a positional location mechanism is provided for effecting positional location in a condition with the door open. And further, a substrate detection sensor that detects conveyance of the substrate on to the substrate holder and a substrate holding sensor that detects holding of the substrate on the substrate holder is provided.
Thereby, the presence of a substrate supplied to the substrate holder on the door located in position can be detected, and also, the holding of the substrate can be detected. By combination with means for automatic supply and automatic removal of the substrate, an automatic production line with other apparatuses such as a cleaner or coater can be achieved.
While novel features of the invention are set forth in the preceding, the invention, both as to organization and content, can be further understood and appreciated, along with other objects and features thereof, from the following detailed description and examples when taken in conjunction with the attached drawings.


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