Sputtering apparatus

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204192R, C23C 1500

Patent

active

045472793

ABSTRACT:
A magnetron type sputter apparatus utilizing an orthogonal electromagnetic field, with the apparatus being adapted for forming an electrode wiring of a semiconductor device. The apparatus includes a target having a shape adapted to prevent a bumping of a target material from an end part of the target so that a temperature rise and damage of the semiconductor device attributed to electron bombardment can be prevented and the lifetime of the target can be prolonged.

REFERENCES:
patent: 4060470 (1977-11-01), Clarke
patent: 4169031 (1979-09-01), Brors
patent: 4219397 (1980-08-01), Clarke
patent: 4401539 (1983-08-01), Abe et al.
patent: 4414086 (1983-11-01), Lamont
patent: 4422896 (1983-12-01), Class et al.
patent: 4428816 (1984-01-01), Class et al.
patent: 4457825 (1984-07-01), Lamont

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Sputtering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sputtering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sputtering apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2431505

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.