Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1997-09-16
1999-08-31
Nguyen, Nam
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20429819, C23C 1434
Patent
active
059449683
ABSTRACT:
A sputtering apparatus is provided with a magnetic assembly which is rotated and revolved, and the eccentric distance between the rotation axis and the revolution axis is varied. By this arrangement, erosion profile of a target is made uniform, whereby a uniform thin film is deposited on a substrate surface.
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patent: 5188717 (1993-02-01), Broadbent et al.
patent: 5514257 (1996-05-01), Kobayashi et al.
patent: 5643427 (1997-07-01), Kobayashi et al.
Ishihara Masahito
Kobayashi Masahiko
Sahase Hajime
Takahashi Nobuyuki
Anelva Corporation
McDonald Rodney G.
Nguyen Nam
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