Sputtering apparatus

Details Sputtering apparatus Sputtering apparatus

1980-03-18

1981-09-22

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192R, C23C 1500

Patent

active

042908752

ABSTRACT:
The invention describes an electrode assembly for use in a sputtering apparatus.
In the sputtering assembly, a cathode mount is insulatingly supported on an anode and carries a target rod. The target rod has a much smaller surface area than the surrounding surface of the anode. High power is supplied to the cathode so that the temperature of the target rod should reach approximately 1000.degree. C. This results in a high rate of sputtering and in the deposition of a pure coating.

REFERENCES:
patent: 3294669 (1966-12-01), Theurer

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