Sputtering apparatus

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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204192R, C23C 1500

Patent

active

044129068

ABSTRACT:
A sputtering apparatus includes a target and a substrate holder respectively supported in a lower portion and an upper portion of a vacuum chamber, a gas jet opening located near the upper surface of the target, and gas withdrawal conduits located near the substrate holder, so that by supplying a gas to the vacuum chamber through the gas jet opening, the gas pressure in the chamber gradually decreases from the region near the target to the region near the substrate holder.

REFERENCES:
patent: 3976555 (1976-08-01), Von Hartel
patent: 4094764 (1978-06-01), Boucher et al.
patent: 4128466 (1978-12-01), Harding et al.
patent: 4132624 (1979-01-01), King et al.
patent: 4204942 (1980-05-01), Chahroudi

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