Sputtering apparatus

Details Sputtering apparatus Sputtering apparatus

1994-05-25

1995-11-28

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429807, 20429811, C23C 1434, C23C 1452, C23C 1454

Patent

active

054704510

ABSTRACT:
A sputtering apparatus in which transfer of a substrate and formation of a thin film on the substrate are performed in a face-up manner, the apparatus comprising a cylindrical shield member provided so as to surround a plasma discharge space in a substantially tightly enclosing state, and a process gas inlet means having gas outlet openings formed in an inner surface thereof. The cylindrical shield member is provided in its inside with a ring-like or cylindrical path so as to communicate with the process gas inlet means and so as to have a plurality of gas outlet openings. Further, a hole for inserting a pressure gauge is formed in the inner surface of the shield member.

REFERENCES:
patent: 4425218 (1984-01-01), Robinson
patent: 4946576 (1990-08-01), Dietrich et al.
patent: 5108569 (1992-04-01), Gilboa et al.
patent: 5228968 (1993-07-01), Zejda

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