Sputtering apparatus

Details Sputtering apparatus Sputtering apparatus

1980-07-15

1982-03-09

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192R, C23C 1500

Patent

active

043187960

ABSTRACT:
There is disclosed a sputtering apparatus for the deposition of thin films of a material other than metals on substrates, comprising a pair of opposed electrodes one of which is adapted to mount a substrate, wherein a target of a material other than metals, from which thin-film-forming atoms are ejected by ion-bombardment during sputtering, is mounted on the other electrode, said target comprising at least two target members stacked on one another.
This target installation prevents thin films of a material other than metals from contamination resulting from breakage of the target which in turn results from an increase of the film-forming rate or physical properties of the target material.

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