Sputtering apparatus

Details Sputtering apparatus Sputtering apparatus

1991-09-30

1993-10-19

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429807, 2042982, 20429825, 20429828, 20419212, C23C 1434

Patent

active

052542360

ABSTRACT:
In a sputtering apparatus comprising a film-deposition chamber having a gas-supplying pipe connected thereto, for depositing a film on the surface of a substrate to be processed, a target provided in the film-deposition chamber, a mask having an opening portion and a masking portion, the mask being provided opposing to the target in the film-deposition chamber, and holding means for holding the substrate against the mask in such a manner that the film-depositing surface of the substrate is in close contact with the mask, the improvement according to the present invention comprises a mask having exhaust passages formed in the masking portion thereof, each of exhaust passages having one end exposed to the inside of the film-deposition chamber and the other end exposed to the outside of the film-deposition chamber, the one end of each of the exhaust passages and the other end thereof being communicated with each other, but not seen through each other.

REFERENCES:
patent: 4444643 (1984-04-01), Garrett
patent: 4820371 (1989-04-01), Rose
patent: 4849087 (1989-07-01), Meyer
patent: 4886592 (1989-12-01), Anderle et al.
patent: 4938858 (1990-07-01), Zejda
Singulus Catalog (not clearly dated) "A Family of Single Disc Metallizing Systems".

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