Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1986-10-24
1988-01-05
Demers, Arthur P.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20419215, 20419223, 20419225, C23C 1400
Patent
active
047174625
ABSTRACT:
A sputtering apparatus comprising an intermediate electrode having a plurality of openings disposed between a cathode and a substrate electrode.
The directionality of the particles which are liberated from a target by the collision of ions against the target is made remarkably uniform by the presence of the intermediate electrode, and thus a thin film having a superior step coverage can be deposited on the substrate placed on the substrate electrode.
REFERENCES:
patent: 3730873 (1973-05-01), Pompei
patent: 3968019 (1976-07-01), Hanazono et al.
patent: 4158589 (1979-06-01), Keller et al.
patent: 4318796 (1982-03-01), Nishiyama et al.
patent: 4395323 (1983-07-01), Denton et al.
patent: 4426274 (1984-01-01), Ephrath
patent: 4540466 (1985-09-01), Nishizawa
patent: 4572759 (1986-02-01), Benzing
patent: 4579618 (1986-04-01), Celestino et al.
patent: 4581118 (1986-04-01), Class et al.
patent: 4624767 (1986-11-01), Obinata
Hom-ma Yoshio
Sasabe Shunji
Tsunekawa Sukeyoshi
Demers Arthur P.
Hitachi , Ltd.
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