Sputter target/backing plate assembly and method of making same

Details Sputter target/backing plate assembly and method of making same Sputter target/backing plate assembly and method of making same

1998-10-14

2000-06-13

Ryan, Patrick

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228164, 228170, 228172, 228174, 228205, B23K 120, B23K 5213, B23K 2024, B23K 3102, B21D 3900

Patent

active

060738308

ABSTRACT:
This invention is directed to an improved bonded sputter target/backing plate assembly and a method of making these assemblies. The assembly includes a sputter target having side and bottom bonding surfaces bonded within a recess in an underlying backing plate, the recess having top and side bonding surfaces. The method of forming the bonded assembly includes treating the bonding surfaces of either the sputter target or backing plate recess by roughening at least a portion of the bonding surfaces so as to produce a roughened portion having a surface roughness (R.sub.a) of at least about 120 micro-inches. The method further includes orienting the sputter target within the backing plate recess to form one assembly having a parallel interface defined by the top and bottom bonding surfaces and a side interface defined by the side bonding surfaces, subjecting the assembly to a controlled atmosphere, heating the assembly, and pressing the assembly so as to bond the bonding surfaces.

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John G. Banker et al., "Explosion Welding", ASM Handbook, vol. 6, Welding, Brazing and Soldering, pp. 303-305 (1993).

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