Sputter target/backing plate assembly and method of making same

Details Sputter target/backing plate assembly and method of making same Sputter target/backing plate assembly and method of making same

1995-08-16

1999-01-12

Nuzzolillo, M.

Metal fusion bonding

Process

Diffusion type

228190, 2282351, 2282625, 22826271, 2282627, 22826221, 228222, 228214, 20429812, 20429813, B23K 2000, C23C 1434

Patent

active

058576118

ABSTRACT:
A method of forming a sputter target/backing plate assembly comprises the steps of: providing a target fabricated from a first material having a coefficient of thermal expansion; providing a backing plate fabricated from a second material having a coefficient of thermal expansion; providing a block fabricated from a third material having a coefficient of thermal expansion; positioning the block on one side of the backing plate; positioning the target on the other side of the backing plate; and subjecting the target, backing plate and block to elevated temperature and pressure to bond the target, backing plate and block together. The third material is selected so as to have a coefficient of thermal expansion which counteracts the effects of the coefficients of thermal expansion of the first and second materials. The third material may be selected so as to have a coefficient of thermal expansion which is approximately the same as the coefficient of thermal expansion of the first material.

REFERENCES:
patent: 5230459 (1993-07-01), Mueller et al.
patent: 5397050 (1995-03-01), Mueller
Diffusion Bonded W-Ti Sputtering Target, Solid State Technology, Sep. 1994.

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