Sputter target/backing plate assembly and method of making same

Details Sputter target/backing plate assembly and method of making same Sputter target/backing plate assembly and method of making same

1995-04-21

1998-11-17

Rodee, Christopher D.

Metal fusion bonding

Process

With shaping

228164, 228170, 228174, 228203, 228205, 22826244, 2282625, 2282626, 22826271, 20429812, 20429813, B21D 3900

Patent

active

058365060

ABSTRACT:
This invention is directed to an improved method for making a bonded sputter target/backing plate assembly as well as assemblies produced therefrom. The assembly includes a sputter target having a bonding surface which is bonded to the bonding surface of an underlying backing plate. The method of forming the bonded assembly includes treating one of the bonding surfaces, either by roughening at least a portion of one of the bonding surfaces so as to produce a roughened portion having a surface roughness (R.sub.a) of at least about 120 micro inches, or by drilling a plurality of holes in one of the bonding surfaces. The method further includes orienting the sputter target and backing plate to form an assembly having an interface defined by the bonding surfaces, subjecting the assembly to a controlled atmosphere, heating the assembly, and pressing the assembly so as to bond the bonding surfaces.

REFERENCES:
patent: 3186083 (1965-06-01), Wright, Jr.
patent: 5230459 (1993-07-01), Mueller et al.
patent: 5354446 (1994-10-01), Kida et al.
Banker, John G., "Explosion Welding", Solid-State Welding Processes, pp. 303-305.

Affiliated with

Also associated with

Rating

Sputter target/backing plate assembly and method of making same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sputter target/backing plate assembly and method of making same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sputter target/backing plate assembly and method of making same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-876726