Sputter target and process for producing sputter target

Details Sputter target and process for producing sputter target Sputter target and process for producing sputter target

1986-12-18

1988-03-15

Lechert, Jr., Stephen J.

Specialized metallurgical processes, compositions for use therei

Compositions

Consolidated metal powder compositions

75236, 75239, 75240, 75242, 75244, 204291, 204292, 419 2, 419 12, 419 13, 419 15, 419 16, 419 17, 419 18, 419 26, 419 28, 419 38, 419 44, 419 66, G22C 2904

Patent

active

047311169

ABSTRACT:
Sputter targets and a process for producing sputter targets are provided, comprised of carbides and/or nitrides and/or borides of refractory metals. In a first step, a dense composite body is produced comprised of one or more carbides and/or nitrides and/or borides of the metals of Groups IV A-VI A of the periodic table and a metallic binding agent comprised of one or more metals of the iron group of the periodic table. This composite body in the form of a shaped blank is machined, if necessary, and the binding agent is removed by chemical or electrochemical treatment. The sputter target as so produced has excellent mechanical strength and high thermal shock resistance. Levels of contaminating elements and the residual metallic binding agent are extremely low, meeting the requirements typically placed on sputter targets.

REFERENCES:
patent: 4331476 (1982-05-01), Helderman et al.
patent: 4619695 (1986-10-01), Oikawa et al.
patent: 4619697 (1986-10-01), Hijkata et al.
patent: 4636253 (1987-01-01), Nakai et al.

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