Sputter for deposition of metal layer and fabricating method...

Details Sputter for deposition of metal layer and fabricating method... Sputter for deposition of metal layer and fabricating method...

2007-01-02

2007-01-02

Ngo, Huyen (Department: 2871)

Liquid crystal cells, elements and systems

Nominal manufacturing methods or post manufacturing...

C349S106000, C349S110000, C349S139000, C204S192380, C438S674000

Reexamination Certificate

active

10681140

ABSTRACT:
A fabricating method of a liquid crystal display device includes forming a gate line on a first substrate, forming a data line crossing the gate line, forming a switching element connected to the gate line and the data line, forming a pixel electrode connected to the switching element, forming a black matrix on a second substrate using a sputter, wherein the sputter includes a shield mask having an open portion larger than or equal to the second substrate, forming a color filter layer on the black matrix, forming a common electrode on the color filter layer, attaching the first and second substrates such that the pixel electrode faces the common electrode, and forming a liquid crystal layer between the pixel electrode and the common electrode.

REFERENCES:
patent: 4988424 (1991-01-01), Woodward et al.
patent: 5744214 (1998-04-01), Berasi et al.
patent: 5824197 (1998-10-01), Tanaka
patent: 6057903 (2000-05-01), Colgan et al.
patent: 6362097 (2002-03-01), Demaray et al.
patent: 6407408 (2002-06-01), Zhou et al.
patent: 6461485 (2002-10-01), Mizouchi et al.
patent: 6610179 (2003-08-01), Baldwin et al.
patent: 6847422 (2005-01-01), Zhang et al.
patent: 6951596 (2005-10-01), Green et al.
patent: 11-229132 (1999-08-01), None

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