Sputter etching and coating process

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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Details

20419215, 20419232, C23C 1434

Patent

active

049137891

ABSTRACT:
A process for coating a diagram on a substrate is disclosed, wherein a metal mask is applied to a prepared substrate and subjected to vacuum etching followed by vacuum sputtering. The sputter coating is accomplished at high vacuum using a plurality of spinning magnetrons to give an even deposition of metal on the substrate as well as an acceptable rate of deposition. After the desired thickness of metal is sputtered onto the substrate, the metal mask is stripped from the substrate and the product is finished using known techniques.

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