Sputter coating source having plural target rings

Details Sputter coating source having plural target rings Sputter coating source having plural target rings

1986-04-04

1988-08-02

Niebling, John F.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

2041922, C23C 1436

Patent

active

047612185

ABSTRACT:
A sputter coating source has separate annular targets spaced outwardly from each other around a central axis. Magnetic field generating means are provided to establish magnetic field lines over each target around an annular path. Each target has its own separate magnetic field generating means including an electromagnet having a separately controllable power supply whereby the strength of the magnetic field over each target may be separately controlled. The targets are electrically separated from each other, and each target has a separately controllable power supply whereby the plasma power for each target may be separately controlled. More than two separate targets may be employed, and the various targets may be positioned at different distances from the substrate. The targets may be made of magnetic material.

REFERENCES:
patent: 4275126 (1981-06-01), Bergmann et al.
patent: 4313815 (1982-02-01), Graves, Jr. et al.
patent: 4385979 (1983-05-01), Pierce et al.
patent: 4465575 (1984-08-01), Love et al.
J. L. Vossen et al, Thin Film Processes, Academic Press, New York, 1978, pp. 143-145.

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