Sputter coating source

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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Details

2041922, 20429812, 20429819, C23C 1435

Patent

active

051804786

ABSTRACT:
Sputter coating source in which the target is mounted directly on the front side of the cathode and coolant is circulated on the back side of the cathode. The coolant does not contact the target, and the target is clamped tightly to the cathode by retainers which permit it to be removed and replaced easily without leakage of coolant.

REFERENCES:
patent: 4407708 (1983-10-01), Landau
patent: 4412907 (1983-11-01), Ito et al.
patent: 4485000 (1984-11-01), Kawaguchi et al.
patent: 4500409 (1985-02-01), Boys et al.
patent: 4565601 (1986-01-01), Kakehi et al.
patent: 4855033 (1989-08-01), Hurwitt

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