Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Reexamination Certificate
2006-04-25
2006-04-25
McDonald, Rodney G. (Department: 1753)
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
C204S298230, C118S719000, C414S217000, C414S222010, C414S222040, C414S222080
Reexamination Certificate
active
07033471
ABSTRACT:
A Vacuum transport chamber for disk-shaped substrates, has a base plate structure has an interior surface which borders an interior of the chamber on one side thereof. A covering structure is situated parallel and opposite an interior surface of the base plate structure. The structure has at least two substrate passage openings which are adapted to a substrate disk surface. A transport device which is rotationally drivingly movable about a rotation axis perpendicular to the base plate structure. At least one substrate receiving device is brought into alignment with a respective one of the openings. A controlled sealing arrangement establishes an edge of at least one of the openings with the substrate holding device brought into alignment therewith and a substrate provided thereon.
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R. H. Horng, et al. “Effects of rapid thermal process on structural and electrical characteristics of Y2O3thin films by r.f. -magnetron sputtering” Thin Solid Films, 1996.
Copy of Search Report.
Dubs Martin
Schertler Roman
Crowell & Moring LLP
McDonald Rodney G.
Unaxis Balzers Aktiengesellschaft
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