Spring devices – Bendable along flat surface – Flexural support
Patent
1989-03-10
1990-05-08
Oberleitner, Robert J.
Spring devices
Bendable along flat surface
Flexural support
165 803, 174 163, 267164, 357 81, 361386, 403261, 403372, F16F 118, F16F 120, H01G 303, H01L 2302
Patent
active
049231790
ABSTRACT:
A heat sink assembly to dissipate heat from electrical components to a housing is disclosed. The housing is formed from a suitable heat sinking material including a body with integral continuous walls extending from the perimeter of the body. A carrier mechanism which retains a plurality of electrical components is positioned within the housing. The electrical components have heat sink tabs which are positioned in the housing such that the tabs are coupled with the housing to dissipate heat from the electrical components to the housing. A resilient biasing member including a plurality of resilient fingers is coupled with the carrier mechanism to retain the carrier and electrical components in position on the housing.
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IBM Technical Disclosure Bulletin, vol. 24, No. 7B, Dec., 1981.
Calcaterra Mark P.
Chrysler Corporation
Oberleitner Robert J.
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