Spring mounting of multi-layered electronic assemblies

Details Spring mounting of multi-layered electronic assemblies Spring mounting of multi-layered electronic assemblies

1991-12-19

1993-07-13

Picard, Leo P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361417, 248624, 248626, H05K 712

Patent

active

052279561

ABSTRACT:
A method and apparatus for spring mounting of multi-layered electronic assemblies including a top cover; a bottom cover; first, second, and third mounting supports; a printed wiring board in contact with and supported by the first, second and third mounting supports at first, second, and third mounting locations, respectively; springs for clamping the multi-layered electronic assembly between the top cover and the bottom cover; a load plate for supporting the assembly, the load plate including fourth, fifth, and sixth mounting supports aligning with the first, second, and third mounting locations, respectively, and in contact with the springs; and the top cover contacting the load plate and coupled to the bottom cover, wherein the coupling of the top cover and bottom cover compresses the springs and securely clamps the multi-layered electronic assembly within the top and bottom covers.

REFERENCES:
patent: 2867405 (1959-01-01), Carriston
patent: 3668476 (1972-06-01), Wrabel et al.
patent: 5001603 (1991-03-01), Villaneuva, III et al.

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