Spring loaded module for cooling integrated circuit packages dir

Details Spring loaded module for cooling integrated circuit packages dir Spring loaded module for cooling integrated circuit packages dir

1986-10-14

1988-01-26

Macon, Robert S.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

361385, H01L 2504, H02B 100

Patent

active

047219963

ABSTRACT:
A liquid cooled circuit module comprises an integrated circuit package; a cover having a rim which lies against the integrated circuit package, the cover being shaped to form a passage for the liquid between the integrated circuit package and the cover; a retaining mechanism, which is fastened directly to the integrated circuit package, and which includes a member that extends above the cover; and a spring, which is held in compression between the cover and the retaining mechanism member; the spring being adapted to press the rim against the integrated circuit package with at least a predetermined minimal force which prevents leaks and at the same time not exceed a stress limit in the spring. In one embodiment of the module, the retaining mechanism includes headed pins which are fixedly attached to the integrated circuit package; the retaining mechanism member has tapered openings which are aligned with the pins and in which the headed pins removably lock; and the spring is adapted to maintain at least the predetermined minimal force on the rim and simultaneously not exceed the stress limit even under the condition where the spring is compressed by a variable distance due to several manufacturing tolerances within the module.

REFERENCES:
patent: 2952786 (1960-09-01), Lewis
patent: 3649738 (1972-03-01), Andersson et al.
patent: 4381032 (1983-04-01), Cutchaw
patent: 4479140 (1984-10-01), Horvath
"Device Cooling", A. H. Johnson, IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar. 1978.
"Cooling System for Semiconductor Chips", J. Landrock et al., IBM Technical Disclosure Bulletin, vol. 23, No. 4, Sep. 1980.

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