Spring loaded heat sink retention mechanism

Details Spring loaded heat sink retention mechanism Spring loaded heat sink retention mechanism

2007-03-29

2009-02-24

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C257S718000, C257S719000

Reexamination Certificate

active

07495922

ABSTRACT:
Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described.

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