Spring grid array interconnection for active microelectronic ele

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29845, 357 79, 357 81, 361400, 361401, 361408, 361413, H05K 720

Patent

active

049223763

ABSTRACT:
A mechanical and electrical interconnection of an active integrated circuit to a passive substrate. The interconnection includes a contact retainer having resilient elements disposed in apertures which extend through the retainer so that the elements are radially compressed. The retainer is disposed between the active integrated circuit and the passive substrate. The retainer may be secured either mechanically or through bonding agents to the active integrating circuit and the passive substrate. Axial compression of the resilient elements upon disposing the retainer between the active integrated circuit and the passive substrate provides for wiping action of the resilient elements on the contacts of the active integrated circuit and the passive substrate. The contact retainer may include thermal paths for heat dissipation of the integrated circuits to accommodate a higher density of integrated circuits.

REFERENCES:
patent: 2902628 (1959-09-01), Leno
patent: 3379938 (1968-04-01), Bywaters
patent: 3541222 (1970-11-01), Parks et al.
patent: 3616532 (1971-11-01), Beck
patent: 3680037 (1972-07-01), Nellis
patent: 4050756 (1977-09-01), Moore
patent: 4220383 (1980-09-01), Scheingold
patent: 4278311 (1981-07-01), Scheingold
Markewycz, "Distribution System for Multilayer Ceramic Moduler", IBM Technical Disclosure Bulletin, 11/1976, vol. 19, No. 4, pp. 1270-1271.
Technical Disclosure Bulletin, Gagnon et al, "Plating Through-Holes", IBM 5/1969, vol. 11, No. 12, pp. 1704-1705.
"CIN APSE.TM. A New Patented Technology Bringing PC Interconnects to Speed", Cinch, a division of Labinal Components and Systems, Inc., 1989 (4 pages).
"The Area Array Connector: A Pinless Connection Technique for Pad Grid Array Packages", by Scott S. Simpson, 1987 (8 pages).
"Fuzz Buttons.TM. Wire Mesh Resilient Contact Elements", reprint from Quest through the courtesy of TRW, Inc. Electronics and Defense Sector, Redondo Beach, CA 90278 (9 pagess).
"Fuzz Button.TM. Conductive Connector", Data Sheet FB-320, Aug. 1974, Technical Wire Products, Inc., 1974 (2 pages).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Spring grid array interconnection for active microelectronic ele does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Spring grid array interconnection for active microelectronic ele, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Spring grid array interconnection for active microelectronic ele will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-834066

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.