Spring fixture that attaches a heat sink to a substrate for mult

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

257719, 361710, 361715, H05K 720

Patent

active

061543659

ABSTRACT:
An electrical assembly which includes a heat sink that is pressed into an integrated circuit package by a spring fixture. The integrated circuit package is mounted to a substrate. Inserted through the spring fixture is a screw. The screw is also inserted through a clearance hole of the substrate and into an attachment hole of the heat sink to attach the heat sink to the substrate. Other features are disclosed.

REFERENCES:
patent: 5262925 (1993-11-01), Matta et al.
patent: 5483103 (1996-01-01), Blickhan et al.
patent: 5838542 (1998-11-01), Nelson et al.
patent: 5883782 (1999-03-01), Thurston et al.

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