Spring finger interconnect for IC chip carrier

Geometrical instruments

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29843, 361405, H01R 909

Patent

active

046155732

ABSTRACT:
Apparatus and method for electrically interconnecting two integrated circuit boards, which includes spring finger contact pads positioned on one board which are matched to raised contact pads on a second board in a manner such that the assembly is easily disassembled and reconnectable and such that it provides for exact height registration between boards. Accurate height registration is required when, for example, an electro-optical device referenced with respect to an optical system is mounted on one of the circuit boards.

REFERENCES:
patent: 3723943 (1973-03-01), Hotze
patent: 3984166 (1976-10-01), Hutchison
patent: 3997963 (1976-12-01), Riseman
patent: 4018491 (1977-04-01), Niedzwiecke et al.
patent: 4239312 (1980-12-01), Myer et al.
Metal-Elastomer Connections, Buchoff, Eleventh Annual Connector Symposium Proceedings, pp. 36-43, Oct. 1978.

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