Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-06-06
1996-12-03
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 802, 165 803, 165185, 174 163, 248505, 248510, 257719, 267150, 267160, 361710, 361715, H05K 720
Patent
active
055814425
ABSTRACT:
A spring clip for clamping a heat sink module to an electronic module which has a pair of opposite side edge surfaces and a pair of spaced projections which extend from each side edge surface. The spring clip includes an elongated generally horizontal middle segment, a pair of end segments at opposite ends of the middle segment which extend in a first direction at an upward angle and a finger tab segment which is connected to the middle segment and which extends at an upward angle in a second direction which is opposite the first direction. A spring clip and heat sink assembly is formed by attaching a pair of spring clips to opposite ends of the heat sink for application to an electronic module. A heat dissipating assembly is formed by applying the spring clip and heat sink assembly to an electronic module which has a pair of projections extending from opposite edge surfaces of the electronic module. The horizontal middle segment of the spring clip can be moved from an inactive state above a respected pair of projections to an active state beneath the projections so that the middle segment is biased upwardly against the projections for clamping the heat sink to the electronic component.
REFERENCES:
patent: 4509839 (1985-04-01), Lavochkin
patent: 4716494 (1987-12-01), Bright et al.
patent: 5208731 (1993-05-01), Blomquist
patent: 5251101 (1993-10-01), Liu
patent: 5276585 (1994-01-01), Smithers
patent: 5323845 (1994-06-01), Kin-Shon
patent: 5381305 (1995-01-01), Harmon et al.
patent: 5475564 (1995-12-01), Chiou
Thompson Gregory D.
Wakefield Engineering, Inc.
LandOfFree
Spring clip for clamping a heat sink module to an electronic mod does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Spring clip for clamping a heat sink module to an electronic mod, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Spring clip for clamping a heat sink module to an electronic mod will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-790552