Spring clamp assembly for improving thermal contact between stac

Details Spring clamp assembly for improving thermal contact between stac Spring clamp assembly for improving thermal contact between stac

1996-09-03

1998-06-23

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

248510, 257719, 257726, H05K 720

Patent

active

057711550

ABSTRACT:
A spring clamp device providing a compressive stress to a stack of components includes a spring member and a bracket having attachment structure for engaging mating structure near the bottom of the stack. The bracket is first engaged with the mating structure such that it straddles the stack. The spring member is then latched to the bracket under tension in an assembled configuration, thereby applying an upward reaction on the mating structure with the attachment structure of the bracket and applying a downward reaction force to the top of the stack with the spring member. The oppositely directed forces apply a compressive stress to the stack, which improves thermal contact between the components.

REFERENCES:
patent: 3946276 (1976-03-01), Braun et al.
patent: 5402313 (1995-03-01), Casperson et al.

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