Spring-biased heat sink assembly for a plurality of integrated c

Details Spring-biased heat sink assembly for a plurality of integrated c Spring-biased heat sink assembly for a plurality of integrated c

1993-07-06

1995-07-04

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257724, 361697, 361719, H05K 720

Patent

active

054306116

ABSTRACT:
A spring-biased heat sink assembly for a multi-chip module that has several integrated circuit chips on a substrate. Thermal paste provides a thermal connection between a heat sink and the chips. A beam spring applies pressure to the back side of the substrate, maintaining a constant force that urges the chips against the heat sink and avoids mechanical stress that would otherwise result from lateral motion of the chips such as from differential expansion. A flat flexible cable connects the module with other circuitry.

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Darveaux et al., "Theraml Analysis of a Multi-Chip Package Design", Journal of Electronic Materials, vol. 18, No. 2, 1988, pp. 267-274.
Darveaux et al., "Backside Cooling of Flip Chip Devices in Multichip Modules", ICMCM Proceedings '92, pp. 230-241.

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