Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1992-03-05
1994-04-05
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 66, 439284, H01R 909
Patent
active
052999394
ABSTRACT:
A spring array connector includes a unitary resilient layer of multiple springs having a layer of multiple electrically conducting lines, electrical contacts and electrical terminals. Each spring of the array is independently bendable and each of the conducting lines is electrically isolated from the other conducting lines. All of the springs in the spring array are fabricated simultaneously. Spring embodiments include sine, helix, cantilever and buckling beam shapes in sheet and wire forms.
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IBM Technical Disclosure, Dunman, vol. 7, No. 3, p. 182, Aug. 1964.
IBM Technical Disclosure, vol. 31, No. 2, p. 101, Jul. 1988.
Walker George F.
Zingher Arthur
Abrams Neil
International Business Machines - Corporation
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